- Product Status:
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- Shape:
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- Width:
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- Length:
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- Attachment Method:
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- Package Cooled:
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- Fin Height:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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- Filter:
167 Records
Image | Part | Manufacturer | Description | MOQ | Price | Stock | Action |
---|---|---|---|---|---|---|---|
![]() |
CUI Devices | HEAT SINK, EXTRUS... |
1,500 |
|
5,000
In-stock
|
Buy Now Get Quote | |
![]() |
CUI Devices | HEATSINK TO-220 4.6W... |
3,000 |
|
5,000
In-stock
|
Buy Now Get Quote | |
![]() |
CUI Devices | HEAT SINK, EXTRUS... |
1,440 |
|
5,000
In-stock
|
Buy Now Get Quote | |
![]() |
CUI Devices | HEAT SINK TO-263 CO... |
9,000 |
|
5,000
In-stock
|
Buy Now Get Quote | |
![]() |
CUI Devices | HEAT SINK, EXTRUS... |
1,000 |
|
5,000
In-stock
|
Buy Now Get Quote | |
![]() |
CUI Devices | HEAT SINK, BGA, 60 ... |
500 |
|
5,000
In-stock
|
Buy Now Get Quote | |
![]() |
CUI Devices | HEATSINK TO-220 3.2W... |
1 |
-
|
5,000
In-stock
|
Get Quote |