272-6325-9UA-1902

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272-6325-9UA-1902

Mfr.Part #: 272-6325-9UA-1902

Manufacturer: 3M

Package/Case: -

Datasheet: Download

Description: TEST BURN-IN PGA

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Manufacturer :: 3M

Product Category :: Sockets for ICs, Transistors

Contact Finish - Mating :: Gold

Contact Finish - Post :: Gold

Contact Finish Thickness - Mating :: 30.0µin (0.76µm)

Contact Finish Thickness - Post :: 30.0µin (0.76µm)

Contact Material - Mating :: Beryllium Copper

Contact Material - Post :: Beryllium Copper

Features :: Closed Frame

Housing Material :: Polyethersulfone (PES)

Mounting Type :: Through Hole

Number of Positions or Pins (Grid) :: 72 (25 x 25)

Operating Temperature :: -55°C ~ 150°C

Pitch - Mating :: 0.100" (2.54mm)

Pitch - Post :: 0.100" (2.54mm)

Product Status :: Last Time Buy

Termination :: Solder

Type :: PGA, ZIF (ZIP)

Datasheets: 272-6325-9UA-1902

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