HSB03-121218
- Mfr.Part #
- HSB03-121218
- Manufacturer
- CUI Devices
- Package/Case
- -
- Datasheet
- Download
- Description
- HEAT SINK, BGA, 12 X 12 X 18 MM
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- Manufacturer :
- CUI Devices
- Product Category :
- Thermal - Heat Sinks
- Attachment Method :
- Adhesive
- Diameter :
- -
- Fin Height :
- 0.709" (18.00mm)
- Length :
- 0.472" (12.00mm)
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- BGA
- Power Dissipation @ Temperature Rise :
- 3.1W @ 75°C
- Product Status :
- Active
- Shape :
- Square, Pin Fins
- Thermal Resistance @ Forced Air Flow :
- 9.60°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 24.01°C/W
- Type :
- Top Mount
- Width :
- 0.472" (12.00mm)
- Datasheets
- HSB03-121218
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