BDN09-3CB

Mfr.Part #
BDN09-3CB
Manufacturer
CTS Thermal Management Products
Package/Case
-
Datasheet
Download
Description
HEATSINK CPU .91" SQ

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Manufacturer :
CTS Thermal Management Products
Product Category :
Thermal - Heat Sinks
Attachment Method :
Thermal Tape, Adhesive (Not Included)
Diameter :
-
Fin Height :
0.355" (9.02mm)
Length :
0.910" (23.11mm)
Material :
Aluminum
Material Finish :
Black Anodized
Package Cooled :
Assorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise :
-
Product Status :
Active
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
9.60°C/W @ 400 LFM
Thermal Resistance @ Natural :
26.90°C/W
Type :
Top Mount
Width :
0.910" (23.11mm)
Datasheets
BDN09-3CB

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Part Manufacturer Stock Description
BDN09-3CB/A01 CTS Thermal Management Products 6,262 HEATSINK CPU W/ADHESIVE .91"SQ