HSS21-B20-P53

Mfr.Part #
HSS21-B20-P53
Manufacturer
CUI Devices
Package/Case
-
Datasheet
Download
Description
HEAT SINK, STAMPING, TO-218/TO-2

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Manufacturer :
CUI Devices
Product Category :
Thermal - Heat Sinks
Attachment Method :
PC Pin
Diameter :
-
Fin Height :
0.500" (12.70mm)
Length :
1.000" (25.40mm)
Material :
Aluminum Alloy
Material Finish :
Black Anodized
Package Cooled :
TO-218, TO-220
Power Dissipation @ Temperature Rise :
-
Product Status :
Active
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
-
Thermal Resistance @ Natural :
-
Type :
Board Level
Width :
0.961" (24.40mm)
Datasheets
HSS21-B20-P53

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