HSE04-251265-1

Mfr.Part #
HSE04-251265-1
Manufacturer
CUI Devices
Package/Case
-
Datasheet
Download
Description
HEAT SINK, EXTRUSION, TO-218/TO-

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Manufacturer :
CUI Devices
Product Category :
Thermal - Heat Sinks
Attachment Method :
Bolt On
Diameter :
-
Fin Height :
0.256" (6.50mm)
Length :
0.984" (25.00mm)
Material :
Aluminum Alloy
Material Finish :
Black Anodized
Package Cooled :
TO-218, TO-220
Power Dissipation @ Temperature Rise :
2.4W @ 75°C
Product Status :
Active
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
16.30°C/W @ 200 LFM
Thermal Resistance @ Natural :
31.22°C/W
Type :
Top Mount
Width :
0.472" (12.00mm)
Datasheets
HSE04-251265-1

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