HSE08-505028
- Mfr.Part #
- HSE08-505028
- Manufacturer
- CUI Devices
- Package/Case
- -
- Datasheet
- Download
- Description
- HEAT SINK, EXTRUSION, TO-218/TO-
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- Manufacturer :
- CUI Devices
- Product Category :
- Thermal - Heat Sinks
- Attachment Method :
- Clip
- Diameter :
- -
- Fin Height :
- 1.969" (50.00mm)
- Length :
- 1.969" (50.00mm)
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- TO-218, TO-220
- Power Dissipation @ Temperature Rise :
- 10.53W @ 75°C
- Product Status :
- Active
- Shape :
- Rectangular, Fins
- Thermal Resistance @ Forced Air Flow :
- 2.70°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 7.13°C/W
- Type :
- Board Level
- Width :
- 1.102" (28.00mm)
- Datasheets
- HSE08-505028
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