HSE07-753045
- Mfr.Part #
- HSE07-753045
- Manufacturer
- CUI Devices
- Package/Case
- -
- Datasheet
- Download
- Description
- HEAT SINK, EXTRUSION, TO-218/TO-
Request A Quote(RFQ)
- * Contact Name:
- * Company:
- * E-Mail:
- * Phone:
- * Comment:
- * Captcha:
-
- Manufacturer :
- CUI Devices
- Product Category :
- Thermal - Heat Sinks
- Attachment Method :
- Clip
- Diameter :
- -
- Fin Height :
- 1.772" (45.00mm)
- Length :
- 2.953" (75.00mm)
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- TO-218, TO-220
- Power Dissipation @ Temperature Rise :
- 15.46W @ 75°C
- Product Status :
- Active
- Shape :
- Rectangular, Fins
- Thermal Resistance @ Forced Air Flow :
- 2.10°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 4.85°C/W
- Type :
- Board Level
- Width :
- 1.181" (30.00mm)
- Datasheets
- HSE07-753045
Manufacturer related products
Catalog related products
Related products
Part | Manufacturer | Stock | Description |
---|---|---|---|
HSE01-193175 | CUI Devices | 1,584 | HEAT SINK, EXTRUSION, 19 X 31.5 |
HSE01-193175P | CUI Devices | 1,584 | HEAT SINK, EXTRUSION, 19 X 31.5 |
HSE02-173213 | CUI Devices | 5,000 | HEAT SINK, EXTRUSION, 17 X 31.9 |
HSE02-173213P | CUI Devices | 5,000 | HEAT SINK, EXTRUSION, 17 X 31.9 |
HSE04-251265-1 | CUI Devices | 5,000 | HEAT SINK, EXTRUSION, TO-218/TO- |
HSE04-251265-2 | CUI Devices | 5,000 | HEAT SINK, EXTRUSION, TO-218/TO- |
HSE05-171933 | CUI Devices | 5,000 | HEAT SINK, EXTRUSION, TO-218/TO- |
HSE06-503045 | CUI Devices | 5,000 | HEAT SINK, EXTRUSION, TO-218/TO- |
HSE08-505028 | CUI Devices | 5,000 | HEAT SINK, EXTRUSION, TO-218/TO- |
HSE09-755028 | CUI Devices | 5,000 | HEAT SINK, EXTRUSION, TO-218/TO- |