HSE07-753045

Mfr.Part #
HSE07-753045
Manufacturer
CUI Devices
Package/Case
-
Datasheet
Download
Description
HEAT SINK, EXTRUSION, TO-218/TO-

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Manufacturer :
CUI Devices
Product Category :
Thermal - Heat Sinks
Attachment Method :
Clip
Diameter :
-
Fin Height :
1.772" (45.00mm)
Length :
2.953" (75.00mm)
Material :
Aluminum Alloy
Material Finish :
Black Anodized
Package Cooled :
TO-218, TO-220
Power Dissipation @ Temperature Rise :
15.46W @ 75°C
Product Status :
Active
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
2.10°C/W @ 200 LFM
Thermal Resistance @ Natural :
4.85°C/W
Type :
Board Level
Width :
1.181" (30.00mm)
Datasheets
HSE07-753045

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